{"id":"https://openalex.org/A5000362124","orcid":"https://orcid.org/0000-0001-7856-2503","observed_orcids":["https://orcid.org/0000-0001-7856-2503"],"display_name":"A. Peralta","raw_author_names":["A Peralta","A. Peralta","Andrea Hermoza Peralta"],"full_name":"A. Peralta","works_count":7,"cited_by_count":131,"summary_stats":{"2yr_mean_citedness":0.0,"h_index":5,"i10_index":3},"ids":{"openalex":"https://openalex.org/A5000362124","orcid":"https://orcid.org/0000-0001-7856-2503","observed_orcids":["https://orcid.org/0000-0001-7856-2503"]},"affiliations":[{"institution":{"id":"https://openalex.org/I1311157440","ror":"https://ror.org/047xrr705","display_name":"Peruvian University of Applied Sciences","country_code":"PE","type":"education","lineage":["https://openalex.org/I1311157440"]},"years":[2026]},{"institution":{"id":"https://openalex.org/I82514191","ror":"https://ror.org/02t71h845","display_name":"Honeywell (United States)","country_code":"US","type":"company","lineage":["https://openalex.org/I82514191"]},"years":[2015]}],"last_known_institutions":[{"id":"https://openalex.org/I1311157440","ror":"https://ror.org/047xrr705","display_name":"Peruvian University of Applied Sciences","country_code":"PE","type":"education","lineage":["https://openalex.org/I1311157440"]}],"topics":[{"id":"https://openalex.org/T10705","display_name":"Additive Manufacturing Materials and Processes","count":4,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","count":3,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","count":3,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10396","display_name":"Fatigue and fracture mechanics","count":1,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10703","display_name":"Business Process Modeling and Analysis","count":1,"subfield":{"id":"https://openalex.org/subfields/1404","display_name":"Management Information Systems"},"field":{"id":"https://openalex.org/fields/14","display_name":"Business, Management and Accounting"},"domain":{"id":"https://openalex.org/domains/2","display_name":"Social Sciences"}}],"topic_share":[{"id":"https://openalex.org/T13965","display_name":"Laser and Thermal Forming Techniques","value":2.33e-05,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10705","display_name":"Additive Manufacturing Materials and Processes","value":2.1e-05,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","value":1.34e-05,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13773","display_name":"International Labor and Employment Law","value":1.29e-05,"subfield":{"id":"https://openalex.org/subfields/3320","display_name":"Political Science and International Relations"},"field":{"id":"https://openalex.org/fields/33","display_name":"Social Sciences"},"domain":{"id":"https://openalex.org/domains/2","display_name":"Social Sciences"}},{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","value":1.03e-05,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"x_concepts":[{"id":"192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","score":0.7273504734039307},{"id":"98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","score":0.5426055192947388},{"id":"41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","score":0.44594326615333557},{"id":"127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","score":0.2768971025943756},{"id":"111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","score":0.0}],"counts_by_year":[{"year":1989,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":1994,"works_count":1,"oa_works_count":0,"cited_by_count":0},{"year":2015,"works_count":2,"oa_works_count":0,"cited_by_count":0},{"year":2016,"works_count":0,"oa_works_count":0,"cited_by_count":4},{"year":2017,"works_count":2,"oa_works_count":0,"cited_by_count":9},{"year":2018,"works_count":0,"oa_works_count":0,"cited_by_count":11},{"year":2019,"works_count":0,"oa_works_count":0,"cited_by_count":16},{"year":2020,"works_count":0,"oa_works_count":0,"cited_by_count":19},{"year":2021,"works_count":0,"oa_works_count":0,"cited_by_count":14},{"year":2022,"works_count":0,"oa_works_count":0,"cited_by_count":18},{"year":2023,"works_count":0,"oa_works_count":0,"cited_by_count":13},{"year":2024,"works_count":0,"oa_works_count":0,"cited_by_count":8},{"year":2025,"works_count":0,"oa_works_count":0,"cited_by_count":4},{"year":2026,"works_count":1,"oa_works_count":1,"cited_by_count":8}],"display_name_alternatives":["A Peralta","A. Peralta","Andrea Hermoza Peralta"],"block_key":"a peralta","works_api_url":"https://api.openalex.org/works?filter=author.id:A5000362124","awards_count":0,"awards_api_url":"https://api.openalex.org/awards?filter=investigators.author.id:A5000362124","updated_date":"2026-11-10T14:30:39","created_date":"2016-06-24T00:00:00"}